2006実装プロセステクノロジー展

JISSO PROTECはマウンタメーカーが一堂に会する唯一の実装技術専門展示会「2006実装プロセステクノロジー展」は2006年10月4月(水)~6日(金)に幕張メッセで開催されます。

Highlights

1.Mounter Makers Gather in One Place
JISSO PROTEC is the only exhibition specialized in Jisso technology where mounter makers come together. Miniaturization, weight saving of electronic devices, advanced technology supporting miniaturization of electronic parts and semiconductors, high density wiring boards, material technology and other technologies which contribute considerably to development of a world-wide electronics industry are displayed as Jisso process technology.
List of Exhibitors (Japanese alphabetical order)
2.Fulfilling Lineup of Products
At JISSO PROTEC, a lineup of products which responds to the needs of all Jisso facility users is provided. Solutions to solve current issues such as lowering of consumed electricity, heat generation design, noise measures, speeding up of operation frequency, environmental care, reduction of the development period, cost efficiency, etc. will be found.
List of Exhibitors (search by product classification)
3.JISSO PROTEC Forum,  Seminars by Exhibitors
JISSO PROTEC consolidates corporate displays, JISSO/PROTEC Forum Japan 2006 seminars by exhibitors and clues on how to directly connect with business tomorrow. Please attend sessions where one can experience the frontline of Jisso technology and collect information that can only be provided there.
Event Forum
4.Entering the venue of CEATEC JAPAN
Those who enter JISSO PROTEC can freely enter the CEATEC JAPAN exhibition hall without additional registration procedures. Shuttle buses will run between JISSO PROTEC and CEATEC JAPAN sites. This is a precious opportunity to see the results of the latest products realized by Jisso technology.
CEATEC JAPAN Official Web Site

List of Exhibited Products

Electronic component implementation machinery and related devices and systems
Electronic component loading machines, electronic component inset machines, cream tin solder printers, soldering devices (dip tank, reflow oven), and dispensers
Electric manufacturing related devices and systems
Conveying system, substrate manufacturing device/system, taping machine/material, bulk feeder/other feeders, and automatic fabrication devices
Semiconductor implementation devices/systems
Wire bonders, dai bonders, flip chip implementation systems, LCD/COG bonding systems, BGA/CSP fabrication systems, TAB implementation systems, the OLB/ILB system, and the COB system
Investigation/Testing Devices
Substrate appearance investigation devices, semiconductor manufacturing related investigation/measurement devices, other implementation related investigation/measurement devices
Implementation design systems
Design tools, production optimization software, implementation programming devices, substrates
Implementation devices/components and related materials
SMD, MCM/LSI packages, circuit formation material/devices (chip component, IC/QFP, connector socket, switch, sealing resin, adhesion bond), bulk supply components
Implementation wrapping materials
Taping reel, carrier tape, TAB tape/reel, magazine stick, IC tray, bulk case
Implementation joining system
System, soldering device, solder/joining material, under fill material
High frequency compatible divide devide/components/materials
Devices, components, materials
Environment related devices/materials
Zero mission process, waste disposal/recover device, waste disposal/recovery material
Publication