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JISSO PROTEC is the only exhibition specialized in Jisso technology where mounter makers come together.
Miniaturization, weight saving of electronic devices, advanced technology supporting miniaturization of electronic parts and semiconductors, high density wiring boards, material technology and other technologies which contribute considerably to development of a world-wide electronics industry are displayed as Jisso process technology.
- List of Exhibitors (Japanese alphabetical order)
At JISSO PROTEC, a lineup of products which respondｓ to the needs of all Jisso facility users is provided. Solutions to solve current issues such as lowering of consumed electricity, heat generation design, noise measures, speeding up of operation frequency, environmental care, reduction of the development period, cost efficiency, etc. will be found.- List of Exhibitors (search by product classification)
JISSO PROTEC consolidates corporate displays, JISSO/PROTEC Forum Japan 2006 seminars by exhibitors and clues on how to directly connect with business tomorrow. Please attend sessions where one can experience the frontline of Jisso technology and collect information that can only be provided there.- Event Forum
Those who enter JISSO PROTEC can freely enter the CEATEC JAPAN exhibition hall without additional registration procedures. Shuttle buses will run between JISSO PROTEC and CEATEC JAPAN sites. This is a precious opportunity to see the results of the latest products realized by Jisso technology.- CEATEC JAPAN Official Web Site
- Electronic component implementation machinery and related devices and systems
- Electronic component loading machines, electronic component inset machines, cream tin solder printers, soldering devices (dip tank, reflow oven), and dispensers
- Electric manufacturing related devices and systems
- Conveying system, substrate manufacturing device/system, taping machine/material, bulk feeder/other feeders, and automatic fabrication devices
- Semiconductor implementation devices/systems
- Wire bonders, dai bonders, flip chip implementation systems, LCD/COG bonding systems, BGA/CSP fabrication systems, TAB implementation systems, the OLB/ILB system, and the COB system
- Investigation/Testing Devices
- Substrate appearance investigation devices, semiconductor manufacturing related investigation/measurement devices, other implementation related investigation/measurement devices
- Implementation design systems
- Design tools, production optimization software, implementation programming devices, substrates
- Implementation devices/components and related materials
- SMD, MCM/LSI packages, circuit formation material/devices (chip component, IC/QFP, connector socket, switch, sealing resin, adhesion bond), bulk supply components
- Implementation wrapping materials
- Taping reel, carrier tape, TAB tape/reel, magazine stick, IC tray, bulk case
- Implementation joining system
- System, soldering device, solder/joining material, under fill material
- High frequency compatible divide devide/components/materials
- Devices, components, materials
- Environment related devices/materials
- Zero mission process, waste disposal/recover device, waste disposal/recovery material
- Publication
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