Jisso Process Technology Exhibition 2006

On the Front Lines of Jisso -- From Here to Tomorrow's Business -- Jisso Process Technology Exhibition 2006 Oct. 4(Wed)- 6(Fri) at Makuhari Messe

Detailed Information

Siemens KK

Booth#:9C11

  
URL:http://www.siemens.co.jp

Exhibition Products
[Electronic Component Placement Machine]、[(PCB) Transfer System]、[Bulk Feeder/Other Feeder]
Contact

Automation and Drives, Electronics Assembly Systems (Sales department

Zip:141-0022  Gotanda NT building, 4-5-2, Higashi Gotanda, Shinagawa-ku, Tokyo, Japan

Tel:(03)5798-2311

Fax:(03)5798-2323

E-mail:siplace.jp@siemens.com

Company Introduction

Since 1887, Siemens Japan has expanded its business not only with its own products and services, but also through strong partnerships with Japanese companies. Siemens has made major achievements in business fields such as medical solutions, hearing instruments, lighting, automation drive & controls, building technology, transportation, automotive systems and communications.

Exhibiting Products

SIPLACE X series – placement system for maximum performance

Category:Electronic Component Placement Machine

SIPLACE X offers the throughput up to 80,000 cph, the fastest in the market. SIPLACE X will demonstrate high density placement of 01005” and improved vision and single feeder functions, which enable even faster changeover and New Product Introduction. With this, SIPLACE X will support customers to achieve high productivity in production.

SIPLACE has been introduced as a high speed modular placement system to the market since 1990 with its unique common platform design. SIPLACE has huge installed base in PCB assembly factories globally, popular with its highly accurate and productive features. For the support structure, SIPLACE has more than 80 service locations, serviced by local engineers.