Jisso Process Technology Exhibition 2006

On the Front Lines of Jisso -- From Here to Tomorrow's Business -- Jisso Process Technology Exhibition 2006 Oct. 4(Wed)- 6(Fri) at Makuhari Messe

Detailed Information

Koh Young Technology Inc.

Booth#:1D04

  
URL:http://www.kohyoung.com

Exhibition Products
[Testing Equipment for the External Appearance of the Substrate]、[Tasting and Measuring Equipment for Semiconductor Manufacturing]
Contact

(Mr. M.Furuya / Mr. JD Shin

Zip:153-789  1405 ACE Techno X, 470-5, Gasan-dong, Geumcheon-gu, Seoul, Korea

Tel:Local 043-485-4117/Korea 82-2-6670-5000

Fax:82-2-6670-5001

E-mail:info@kohyoung.com

Company Introduction

KohYoung's 3D Solder Paste In-line/Off-line Inspection system and 3D Substrate Bump Inspection system are setting a new standard in the Market. Providing metrology accuracy at In-line speeds, enables meaningful process feedback to the paste printing equipment. Ease of use and programming as well as comprehensive SPC Software complete a total solution for process optimization. KohYoung offers In-Line systems to fit different PCB sizes as well as an industry first Table top 3D Paste Inspection.

Exhibiting Products

KY-3030 Series

Category:Testing Equipment for the External Appearance of the Substrate

The best SPI system in the World.
- No Shadow Effects & No Specular Problems
- Highly Reliable and Accurate Inspection Systems
- Fast Real-time 3D Inspection
- Detect all kinds of defects of Solder Pastes
- Extract Solder Paste Volume only.
- 10 min. programming time

KY-3020T

Category:Testing Equipment for the External Appearance of the Substrate

The cost-effective 3D Table Top SPI System
- Compact size version of KY-3030 series
- Excellent tool for your lab.
- Off line system performing the same functions as KY-3030 systems.

SB-3000

Category:Tasting and Measuring Equipment for Semiconductor Manufacturing

True 3D Substrate Bump Inspection
- No Shadow Effects & No Specular Problems
- Highly Reliable and Accurate Inspection Systems
- User Adjustable XY Resolution
- Detect all kinds of defects of Bumps
- Extract Solder Bump Volume only.
- 10 min. programming time