Jisso Process Technology Exhibition 2006

On the Front Lines of Jisso -- From Here to Tomorrow's Business -- Jisso Process Technology Exhibition 2006 Oct. 4(Wed)- 6(Fri) at Makuhari Messe

JISSO PROTEC FORUM 2006 Program

Oct. 4th(Wed) Program

Oct. 4th (Wed) Program
A Exhibition Hall
10:30 - 12:00 Keynote Speech (free admission)

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

10:30 - 10:35
Greeting from the Chairman of the JISSO/PROTEC Forum Organizing Committee
Yoshishiko Misawa
10:35 - 10:40
Introduction of keynote speakerHisao Kasuga
NEC Electronics Corporation
10:40 - 12:00
Keynote Speach(Free)
“Exploit of new market and key technology for JSSO ”
Kanji Otsuka
Special Advisor
Meisei University

(Latest update: 9/29)

Oct. 4th (Wed) Program
A Exhibition Hall
12:40 - 14:45 Trend Session:“Japan’s Electronics Industry in Transition” -Strengthening International Competitiveness-

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

12:40 - 12:45
Introduction of Sessions
Kunishiko Nishi
Chief Engineer ,MONOZUKURI Engineering Support Center, MONOZUKURI Engineering Division
Hitachi, Ltd.
12:45 - 13:45
“Japan’s Electronics Industry in Transition--Strengthening International Competitiveness”Naoki Yamamoto
A.T. Kearney, Inc.
13:45 - 14:45
“Potential of Digital Household Electric Appliances and Strategies of Manufacturing Industry in Japan”Yohei Kanazawa
Equity Research, Director
Nikko Citigroup Limited
15:00 - 17:05 Equipment Set Session: Japan’s Strength:Portable Device JISSO Technology

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

15:00 - 15:05
Introduction of Sessions
Tsunoi Kazuhisa
Director Component Packaging Dept.
FUJITSU LIMITED
15:05 - 15:45
“Packaging Technology of the World’s Smallest HDD”Happoya Akihiko
Ome Complex Packaging Technology Center Group1Group Manager
Toshiba corporation
15:45 - 16:25
“Response to Lead-free Implementation Technology of Mobile Phones and Various Problems”Toshiyuki Shimura
Section No.2 Common Engineering Department BU JP
Sony Ericsson Mobile Communications Japan,Inc.
16:25 - 17:05
“Mounting Technology of Mobile-Computer”Tsunoi Kazuhisa
Director Component Packaging Dept.
FUJITSU LIMITED
B Exhibition Hall
12:40 - 14:45 JISSO Advanced Session: Advanced Technologies Sustaining Miniaturization

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

12:40 - 12:45
Introduction of Sessions
Hiroshi Manita
LSI Technology Group Core Technologies R&D Div. Assistant Manager
Casio Computer CO.,LTD.
12:45 - 13:25
“ The Proposal for Circulation Promotion of System-in-Package-Electronic System Integration Packaging Technology Committee Activity Report- ”Hiroshi Manita
Chairperson
JEITA Electronic System Integration Packaging Technology Committee
13:25 - 14:05
“Recent Trends in Electronic Paper”Heeday Danjo
Electronic Paper Initiative
TOPPAN Printing Co., Ltd.
14:05 - 14:45
“Trends of Fuel Cell for Mobile Electronic Systems”Susumu HONDA
director
NPO Circuit-Network
15:00 - 17:05 Electronic Component Sessions: Electronic Components Sustaining Advanced JISSO Technology

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

15:00 - 15:05
Introduction of Sessions
Kiyoshi Matsui
Car Electronics Sales Division ,Electronic Components Sales & Marketing Group
TDK Corporation
15:05 - 15:45
“Technology Movement and Implementation Technology of Electrically Conductive Macro Molecule Electrolysis Condenser”Hiroshi Tanaka
Electronic Device Company Technology Planning Section.
SANYO Electric Co.,Ltd.
15:45 - 16:25
“Movement for Miniaturization of Multilayer Ceramic Capacitor and Implementation Technology”Yukio Tanaka
Components Business Unit, Research & Development Group, JISSO Engineering Department, General Manager
Murata Mfg.Co.,Ltd.
16:25 - 17:05
“Rapid and accurate analysis of substances regulated by the RoHS directive"Masahiro Oishi
Technology Group, Materials Analysis Center
TDK Corporation

(Latest update: 9/29)

Oct. 5th (Thu) Program

Oct. 5th (Thu) Program
A Exhibition Hall
12:30 - 17:00 JISSO Facilities Session:At the Front Lines of JISSO Facilities for the Latest JISSO Technologies

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

12:30 - 12:35
Introduction of Sessions
Tokio Shirakawa
Manager, SE Team, Product Planning Group
Panasonic Factory Solutions Co., Ltd.
12:35 - 13:25
“01005 micro chip component and SMT Equipments”Katsuhiko Ohno
Manager, SE Team, Product Planning Group
Panasonic Factory Solutions Co., Ltd.
13:25 - 14:15
“Jisso technologies for next-generation mobile devices”Morita Takeshi?Tomoyasu Kazuhiko
Electronic Component Mounting Systems & Solution Business Unit
Panasonic Factory Solutions Co., Ltd.
14:15 - 15:05
“Latest Jisso Technology and Equipment”Tomohiko Hattori
Technical Development Center
Fuji Machine Manufacturing Co.,Ltd.
15:05 - 15:20
Recess
15:20 - 16:10
“The most advanced Jisso Technology."Toshiyuki Kusunoki?Naonobu Ookawa
IM Company SMT Engineering Group
YAMAHA MOTOR Co.,LTD.
16:10 - 17:00
“Stencil-Free Jet Printer : MY500”Toshimitsu SAKAKI
Sales Engineering
MYDATA Automation K.K.
B Exhibition Hall
12:30 - 17:30 Semiconductor PKG Session:Future SiP Technology Directions for Digital Home Appliances

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

12:30 - 12:35
Introduction of Sessions
Ryo Haruta
Package Engineering Department
Renesas Technology Corp.
12:35 - 13:15
“3D technology development in chip-stacked SiP”Hirofumi Nakajima
Advanced device development division
NEC Electronics Corp.
13:15 - 13:55
“Advanced SiP・PoP Packaging Technology Development using SMT Process"Yasumitsu Orii
Engineering & Technology Services, High Density Packaging Development, Manager
IBM Japan, Ltd.
13:55 - 14:35
“EAD Type SiP Technology”Takeshi Wakabayashi
CASIO COMPUTER CO.,LTD.
14:35 - 15:15
“Modeling technique by using the thermal deformation measurement system based on Digital image Correlation method.”Nishio Toshihiko
Engineering & Technology Services, Technology director
IBM Japan, Ltd.
15:15 - 15:30
Recess
15:30 - 16:10
“Thin Chip Technology For System in Package”Tomoo Hayashi
B.G.GROUP
Tokyo Seimitsu Co.,LTD
16:10 - 16:50
“Molding technology for System in Package”Kazuhiro Arai
Application Engineering Dept. Assistant Manager
SHINKAWA LTD.
16:50 - 17:30
“Molding technology for System in Package”Tomonori Himeno
MARKETING DEPT. MOLD DEC. SENIOR STAFF
TOWA Corporation

(Latest update: 9/29)

Oct. 6th (Fri) Program

Oct. 6th (Fri) Program
A Exhibition Hall
10:30 - 12:35 Bulk JISSO Session:Bulk JISSO--The New Era of JISSO

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

10:30 - 10:35
Introduction of Sessions
Tadashi Habu
Tadashi Habu
Murata Manufacturing Company, Ltd.
10:35 - 11:05
“Technical trend of new bulk packaging”Joji Kobayashi
Components Business Unit, Research & Development Group, JISSO Engineering Department, SMT & Package Engineering Section Manager
Murata Mfg.Co.,Ltd.
11:05 - 11:35
“Bulk Mounting For Chip Resistors”Hideyui Miura
Sales Department Sales Engineering Group
11:35 - 12:05
“Bulk Arrangement in Inline Implementation in Various Kind Variable Cell Production”Yusuke Mori
Production Engineering Section Manager
SUNX Limited
12:05 - 12:35
“Bulk chip placement in clean room and its measures to prevent from getting wrong value parts mixed”Osamu Maki
SMT Equipment (ounting(SMT) Manufacturing Dept.
13:30 - 17:05 Lead-free Session:Lead-free JISSO--To a New Stage

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

13:30 - 14:10
“Suppression technique of tin whisker formation;JMI (JVC Micro- Island)method & plating technology”Makoto Takeuchi
Production Engineering Div., Production Engineering Lab. Senior Staff Engineer
Victor Company of Japan, Limited
14:10 - 14:50
“Whisker-Restrained Pb-Free Solder”Yoshitou Hayashida
ASSEMBLY MATERIALS R&D
TAMURA KAKEN CORPORATION
14:50 - 15:30
"A test method to judge lead content in lead-free solder to be it by a change of a color of a special chelating reagent."
Kunio Nakajima
Center President Chemical Development Research Institute
G.W.International,Inc.
15:30 - 15:45
Recess
15:45 - 16:25
“The Latest Trend of Lead-free Solder technology ”Yoshitaka Toyoda
Research & Development Technicalcenter Manager
16:25 - 17:05
“The latest trend of Sn-Zn solder”Koichi Hagio
Deputy General Manager Technical Department
B Exhibition Hall
10:30-12:35 Print Wiring Board Sessions:Bulk JISSO--The New Era of JISSO

Your online registration is complete. For those interested in participating in the Forum, please go directly to the assembly hall.

10:30 - 10:35
Introduction of Sessions
Henry H. Utsunomiya
President
Interconnection Technologies, Inc.
10:35 - 11:15
“Technology Trends on Cutting Edge Printed Wiring Boards”Henry H. Utsunomiya
President
Interconnection Technologies, Inc.
11:15 - 11:45
“Design Evaluation Support of SiP Substrate and Component Housing Technology”Hajime Tomokage
Department of Electronics Engineering & Computer Science
Fukuoka University
11:45 - 12:35
“Advanced Analysis Technology Applied to SiP and Embedded Substrate”Ken Sugiura
Vice-Manager
Fukuryo Semicon Engineering Corporation

(Latest update: 9/29)